G-10 copper-clad laminates sheets
G-10 copper-clad laminates sheets consist of E-glass fabric, impregnated with
epoxy resin and clad with electrolytic copper foil.
G-10 copper-clad laminates sheets have excellent electric and mechanical properties. The laminates are widely used for PWB with printed circuit on one or both side in computers, communication apparatus and other high grade electronic instruments.
Main properties
|
No |
Item |
Unit |
Conditioning |
Normal value |
|
|
1 |
Peel strength |
min. |
N/mm |
A |
1.4 |
|
2 |
Solder float at 260℃ |
min. |
s |
A |
20 |
|
3 |
Flexural strength |
min. |
MPa |
A |
300 |
|
4 |
Pull-off strength |
min. |
N |
A |
60 |
|
5 |
Surface resistance |
min. |
MΩ |
C-96/20/65+C-96/40/90 125℃ |
5X104 1X103 |
|
6 |
Volume resistivity |
min. |
MΩ·m |
C-96/20/65+C-96/40/90 125℃ |
1X104 1X103 |
|
7 |
Dielectric constant |
max. |
----- |
C-96/20/65+C-96/40/90 |
5.5 |
|
8 |
Dissipation factor |
max. |
----- |
C-96/20/65+C-96/40/90 |
0.035 |
|
9 |
Water absorption |
max. |
mg |
E-24/50+D-24/23 |
20 |
Note: All the data listed in the table are typical values from
G-10 CCL in thickness of 1.6mm and with copper foil in 35 mm.
FR-1 copper-clad laminates sheets
FR-1 copper-clad laminates sheets consist of bleached wood pulp paper, impregnated with flammretardant phenolic-epoxy resin and clad with electrolytic copper foil.
FR-1 copper-clad laminates sheets have high electrical stability, good flammretardancy, good dimentional stability and smoothness, good punching ability and widely used for Hi-Fi acoustic devices, colour TV sets and other electronic appliances.
|
Type |
Corresponding to standards |
||
|
GB |
IEC |
NEMA |
|
|
SB-338F |
CPFCP09F |
IEC-249-2-14-FV |
FR-1 |
Main properties
|
No |
Item |
Unit |
Conditioning |
Normal value |
|
|
1 |
Solder float at 260℃ |
min. |
s |
A |
10 |
|
2 |
Peel strength |
min. |
N/mm |
A S-5S/260℃ |
---- 1.0 |
|
3 |
Flexural strength |
min. |
MPa |
A |
90 |
|
4 |
Water absorption |
max. |
% |
E-24/50+D-24/23 |
1.2 |
|
5 |
Volume resistivity |
min. |
MΩ·m |
100℃: E-2/100 C-96/20/65+C-96/40/90 |
10 100 |
|
6 |
Surface resistance |
min. |
MΩ |
100℃: E-2/100 C-96/20/65+C-96/40/90 |
15 100 |
|
7 |
Insulation resistance |
min. |
MΩ |
C-96/20/65 C-96/20/65+D-2/100 |
1X105 1X102 |
|
8 |
Dielectric constant |
max. |
----- |
C-96/20/65 C-96/20/65+D-48/50 |
5.3 5.6 |
|
9 |
Thermal resistance |
----- |
E-1/180℃ |
No blister or delamination |
|
|
10 |
Flammability (UL’s method) |
----- |
A |
FVO/FV1 |
Note: All the data listed in the table are typical values from
FR-1 CCL in thickness of 1.6mm and with copper foil in 35 mm.
XPC copper-clad laminates sheets
XPC copper-clad laminates sheets consist of bleached wood pulp paper, impregnated with modified phenolic resin and clad with electrolytic copper foil.
XPC copper-clad laminates sheets have high dimentional stability, good punching behaviour at low temperature, high thermal resistance and are widely used for computers, telephones, Hi-Fi acoustic devices, electronic toys and etc.
1.Thickness and tolerance
|
Nominal thickness |
0.8mm |
1.0mm |
1.2mm |
1.6mm |
2.0mm |
|
Tolerance at single point |
±0.09 |
±0.11 |
±0.12 |
±0.14 |
±0.15 |
|
Size available |
1220 +20 mmX1020 +20 mm |
||||
Note: The following products have same thickness and tolerance as above.
2.Main properties
|
No |
Item |
Unit |
Conditioning |
Normal value |
Typical value |
|
|
1 |
Solder float at 260℃ |
min. |
s |
A |
10 |
15 |
|
2 |
Peel strength |
min. |
N/mm |
A S-5S/260℃ |
---- 1.0 |
1.4 1.2 |
|
3 |
Flexural strength |
min. |
MPa |
A |
80 |
100 |
|
4 |
Water absorption |
max. |
% |
E-24/50+D-24/23 |
---- |
1.8 |
|
5 |
Dissipation factor |
max. |
----- |
C-96/20/65 C-96/20/65+D-48/50 |
---- ---- |
0.05 0.10 |
|
6 |
Dielectric constant |
max. |
----- |
C-96/20/65 C-96/20/65+D-48/50 |
---- ---- |
5.5 6.0 |
|
7 |
Insulation resistance |
min. |
MΩ |
C-96/20/65 C-96/20/65+D-2/100 |
---- ---- |
5x104 50 |
|
8 |
Volume resistivity |
min. |
MΩ·m |
E-2/100 C-96/20/65+C-96/40/90 |
10 100 |
15 180 |
|
9 |
Surface resistance |
min. |
MΩ |
E-2/100 C-96/20/65+C-96/40/90 |
30 1.0x103 |
70 1.5x103 |
|
10 |
Thermal resistance |
----- |
E-1/180℃ |
---- |
No blistering, no peeling-off |
|
|
11 |
Alkali resistance |
----- |
5%NaOH,40℃5min |
---- |
Without notable changes in apperance |
Note: All the data listed in the table are typical values from
XPC CCL in thickness of 1.6mm and with copper foil in 35 mm.
FR-4 Copper-Clad Laminates Sheets
FR-4 copper-clad laminates sheets consist of E-glass fabric, impregnated with flammretardant epoxy resin and clad with electrolytic copper foil.
FR-4 copper-clad laminates sheets have excellent electric, mechanical and flammretardant properties and are widely used for PWB with printed circuit on one or both side in microwave ovens, computers, communication apparatus as well as other high grade electronic instruments.
Main properties
|
No |
Item |
Unit |
Conditioning |
Normal value |
|
|
1 |
Peel strength |
min. |
N/mm |
A |
1.4 |
|
2 |
Flexural strength |
min. |
MPa |
A |
300 |
|
3 |
Solder float at 260℃ |
min. |
s |
A |
20 |
|
4 |
Pull-off strength |
min. |
N |
A |
60 |
|
5 |
Surface resistance |
min. |
MΩ |
C-96/20/65+C-96/40/90 125℃ |
5X104 1X103 |
|
6 |
Volume resistivity |
min. |
MΩ·m |
C-96/20/65+C-96/40/90 125℃ |
1X104 1X103 |
|
7 |
Dielectric constant |
max. |
----- |
C-96/20/65+C-96/40/90 |
5.5 |
|
8 |
Dissipation factor |
max. |
----- |
C-96/20/65+C-96/40/90 |
0.035 |
|
9 |
Flame resistance |
----- |
A |
FVO |
|
|
10 |
Water absorption |
max. |
mg |
E-24/50+D-24/23 |
20 |
Note: All the data listed in the table are typical values from
FR-4 CCL in thickness of 1.6mm and with copper foil in 35 mm.